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AI Workloads — GPU Density & Thermal Envelope

Pre‑launch preview. Projected launch: 2026.

High kW racks with cold‑climate assisted cooling.

Our design envelopes support high-density GPU clusters via mixed air + rear door + immersion pilots, exploiting low ambient temperatures to extend free cooling hours while keeping WUE near zero. Thermal telemetry feeds capacity planning and proactive throttling safeguards.

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